Chinese technology giant Huawei has sent out media invites for its IFA 2018 keynote. The event has been scheduled for August 31 in Berlin, Germany. The company is likely to continue with its tradition of announcing its latest flagship mobile chipset, the HiSilcon Kirin 980 fabricated on the 7nm FinFET process. The first phones with the HiSilicon Kirin 980 system-on-chip (SoC) are expected to be the Huawei Mate 20 and Huawei Mate 20 Pro, which too are expected to be previewed during the IFA 2018 presentation.
The successor to the Kirin 970 SoC – Huawei’s in-house flagship chipset Kirin 980 – was recently leaked by a Chinese website. As per the report, the HiSilicon Kirin 980 will be built on the 7nm FinFET process by TSMC. The maximum clock speed for the module will be 2.8GHz for the four powerful Cortex-A77 cores, and will feature four Cortex-A55 cores for energy and power-efficiency with basic tasks.
The GPU (graphics processing unit) is said to be 1.5 times (50 percent) faster than the Adreno 630 GPU, which Qualcomm with its top-of-the-line Snapdragon 845 SoC.
Watch: Huawei P20 Pro Review
About the Huawei Mate 20 and Mate 20 Pro, these will reportedly come with a massive 6.9-inch OLED display, which is said to be manufactured by Samsung. Other than that, the Mate 20 is likely to feature a dual-camera setup while the Mate 20 Pro could feature an updated triple-camera unit from the Huawei P20 Pro. By far, the rumored specifications for the camera suggest that the Mate 20 Pro could feature a 42-megapixel triple-camera setup at the back.