Earlier this month, Qualcomm announced the new Snapdragon 845 chipset, which promised faster data speed, and a longer battery life. Now, while we saw what the chipset could do, except for Xiaomi Mi 7 and the Samsung Galaxy S9 duo, we are yet to know the list of upcoming smartphones that will run the new SoC. However, from what a latest leak reveals, Sony is working on a new dual-camera smartphone, presumingly the Xperia XZ2 that will run the new chipset.
According to a document shared by GizmoChina, the purported Sony Xperia XZ2 will likely be launched in the first quarter of 2018. The leaked smartphone carries the model number H8216. The document suggests that along with Snapdragon 845 SoC, the phone will be equipped with 4GB of RAM, and 64GB of internal storage. The handset will measure 148×73.4×7.4mm, and will weigh about 156 grams. The leak also suggests that the phone will have an an IP65/68 rating, making it water and dust resistant.
The leak also reveals that the alleged Xperia XZ2 will feature a 5.48-inch Full HD HDR Triluminos display with X-Reality image processing and a screen resolution of 1920×1080 pixels. The document reveals that the phone could come with two 12-megapixel camera sensors at the back, and a 15-megapixel selfie shooter on the front side with an f/2.0 aperture. The device is expected to run Android 8.1 Oreo operating system out-of-the-box, and will be powered by a 3,130mAh battery, which will also support the Quick Charge technology.
Further, it was revealed, that while this may not be the first bezel-less smartphone from the brand, Sony is said to be working on a number of 18:9 smartphones according to some previous leaks. It’s being speculated that next year’s successor to Xperia XZ Premium could be the first. Coming back to the Sony H8216, we can expect the brand to make an official announcement at CES 2018 or MWC 2018 in February.