The key specifications for the next version of Universal Flash Storage have been made public by JEDEC, the association for the development of solid-state technology standards. The new standard called as UFS 3.0 comes almost five years after the introduction of UFS 2.0 and it doubles the performance over older specification.
Similar to UFS 2.0 and UFS 2.1, the UFS 3.0 is also limited to two lanes, but each lane will now be capable of transferring 11.6Gbps compared to 5.8Gbps supported by outgoing standard and has a theoretical bandwidth of 2900Mbps. The new specification also improves the lifespan of NAND cells by providing up to 2.5V of electricity with support for upcoming NAND technologies.
While laptops and flagship smartphones already support UFS storage, the new specification aims to expand to other areas like automobiles. JEDEC aims to accomplish that by extending the operating range to encompass temperatures as low as -40 degree Celsius and up to 105 degree Celsius. Cars are getting more connectivity features and sensors in their quest to add features like self-driving and full autonomy in the distant future.
The advent of this new standard will support the development of self-driving cars. There is no word yet on the availability or retail use of UFS 3.0 standard yet, but smartphone makers are expected to showcase devices with UFS 3.0 storage at MWC 2018 later this month.
Samsung could be the first major smartphone brand to launch devices with UFS 3.0 storage. The Galaxy S9 and the Galaxy S9+ are expected to launch with new features including improved cameras on February 25. The smartphones could support up to 256GB storage with UFS 3.0 support.