Chinese telecommunications and smartphone giant Huawei is now the number two smartphone maker in the world, and is doing all it can to cement its position and challenge the might of Samsung. Part of that includes a strong presence at IFA 2018, where the company has already revealed the Honor Magic 2 on the sidelines of the tech expo that is taking place in Berlin, Germany. Today, Huawei is also set to make another big announcement, which could be the HiSilicon Kirin 980 SoC. The event will kick off at 5:30PM IST.
While most other smartphone makers rely on third-party suppliers for chipsets to power their smartphones, Huawei is one of a handful of companies that develops its own chipsets, thanks to owning its own chipset developer called HiSilicon. The current flagship chipset from HiSilicon is the Kirin 970, which was announced last year and has been on all of Huawei and Honor’s recent flagship and high-end smartphones, including the Honor Play, Honor 10, Huawei Nova 3 and Huawei P20 Pro.
The next-generation chipset could debut on the Huawei Mate 20 and Mate 20 Pro, and will also be on Huawei and Honor’s high-end devices in late 2018 and early 2019. The HiSilicon Kirin 980 is also likely to be the world’s first mass-produced 7nm chipset, and will be made using the fabrication process developed by TSMC. This will boost both performance and efficiency on devices powered by the chipset. Furthermore, the chipset is also likely to carry forward the company’s focus on AI applications, thanks to its dedicated neural processing unit.
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Huawei’s announcements are set to take place today at IFA 2018, and the new chipset will replace the HiSilicon Kirin 970 as the company’s flagship offering. The company also unveiled the Honor Magic 2 from Huawei’s sub-brand, which sports a sliding camera module and an edge-to-edge screen.