Late to join the mobile party, Intel is now aggressively working to increase its presence in the smartphone and tablet market. At the ongoing Mobile World Congress event, the company unveiled its latest and strongest bet to stay relevant in the space. The chipmaker announced “SoFIA” Atom X3 SoCs for low-cost handsets, and “Cherry Trail” Atom X5 and Atom X7.
The Atom X3 chip is aimed at low-cost handsets. The 64-bit capable chipset, packs in 3G radio along with an application processor with support for dual-SIM devices. The company says that with Atom X3 chips, it is looking into affordable handsets costing around $75. The company has partnered with some OEMs including Asus, Wistron, Pegatron to work on affordable handsets.
The Atom X3 has three models: C3130, C3230RK and C3440. The C3130 packs in dual-core 1GHz processor paired with dual-core Mali-400 GPU. The company says that it will provide as much as 50 percent performance boost over the quad-core Cortex-A7 processor. Additionally, it also comes with 21Mbps HSPA+ modem on board.
Both C3230RK and C3440 sport quad-core processors paired with Mali-450MP4 and Mali-T720MP2 GPUs respectively. The company says that C3230RK can provide nearly 80 percent more efficiency than the Cortex A7 processor. The C3440, the-top-of-the-line chipset in the Atom X3 lineup comes with support for 42Mbps HSPA and LTE cat. 6. It supports both dual-SIM connectivity and Voice over LTE. On the Wi-Fi, it can support up to 650Mbps download speed. The company says that this chipset is 33 percent more efficient than the Cortex A53 processor.
The Atom X5 and X7 chipsets, on the other hand, are aimed at high-end devices. Both are based on 14-nm processor, making them more performance efficient while taking less space. However, they consume about the same amount of power as 22-nm process “Bay Trail” predecessors.
The Intel Atom X5 has two models, the Z3800 and Z8500. Both utilize the company’s Gen 8 graphics over ARM designs, and are also LTE modem capable of up to 450Mbps speeds. The company is aiming mid to high range Android and Windows devices. The first batch will be available in within the first half of this year.
The X7 8700 packs in 16 execution units and can provide 50 percent improved graphics than company’s existing top of the line chip. These chips also support WiDi, RealSense, and RealSense 3D.