China-based LeEco with its partner company Coolpad is reportedly working on a new flagship smartphone under its line of ‘Cool’ range of smartphones. Dubbed, Cool 1S, the smartphone has now emerged in latest benchmark leaks where it is shown to have achieved a score of 159039 points. Based on the new leaks, the Cool 1S will come in an iPhone 7-inspired black color option and come powered with Qualcomm’s newer Snapdragon 821 chipset at its helm. The Cool 1S would be the third handset to arrive from the partnership between LeEco and Coolpad after the Cool 1 Dual and the Cool 1C.
The newest leaks are in line with earlier spotting of an unnamed Cool smartphone on the Chinese network certification website TENAA. Expected to be a successor to the Cool 1 Dual smartphone, the Cool 1S is now shown in black – the hottest new color choice after the iPhone 7 and iPhone 7 Plus flagships. The earlier revelations hinted at a design language similar to the LeEco LePro 3 smartphone. However, instead of a brush finish metal design, the Cool 1S appears to feature a solid plastic body with the Cool logo written in the lower end of the rear panel. Additionally, the camera and the front camera of the purported also bear striking resemblance to the one seen on the LePro 3.
The Cool 1S will come powered with Android 6.0.1 Marshmallow with LeEco’s EUI 5.8 custom skin layered atop. According to the leaked screenshots, the purported smartphone will set apart from its predecessors by using the newer Qualcomm Snapdragon 821 chipset which currently powers the Google Pixel XL , OnePlus 3T, and the Asus Zenfone 3 Deluxe smartphone among others. The chipset, advancement over the 820, is proven to be more efficient and boost battery performance.
Based on TENAA listing, the Cool 1S is said to feature a 5.5-inch HD display and come with 4GB or 6GB of RAM options. It will be further available in three storage variants of 32GB, 64GB, and 128GB. Keeping the phone ticking will be a 4,000mAh battery. For smartphone photography enthusiasts, the smartphone will come packed with a 16-megapixel rear camera along with an 8-megapixel front snapper. It further comes with a rear fingerprint sensor as seen on the Cool 1 Dual. ALSO READ: LeEco, Coolpad reportedly working on a successor to Cool 1 Dual; specifications, features leaked
Although the smartphone is expected to be a successor to the Cool 1 Dual, there is no detail whether it will continue with a rear dual-camera setup as seen on its predecessor. The Cool 1 Dual features a pair of 13-megapixel rear cameras with dual-tone LED flash, f/2.0 aperture and PDAF support. The dual-camera module on the smartphone is the same as seen on the Huawei P9, with one of the two rear cameras capturing monochrome while the other capturing in color. For selfies, the Cool 1 comes with an 8-megapixel front camera with f/2.2 aperture and 80-degree wide-angle lens.
If we further compare the Cool 1 Dual with its supposed successor the Cool 1S, the former comes with a USB Type-C support, which is yet to be revealed on the latter. Also, the RAM and storage options are limited to 4GB and 64GB in the Cool 1 Dual. However, in terms of battery capacity, the Cool 1 Dual packed a 4,060mAh battery with further support for fast charging and reverse charging capabilities. ALSO READ: Qualcomm unveils Snapdragon 821 SoC, says it’s 10 pc faster than Snapdragon 820
The TENAA listing further revealed that the Cool smartphone will be available in four more color choices of gold, white, silver, and blue. Although there is no word on the pricing of the smartphone, given the newer specifications, the Cool 1S is expected to be priced higher than its predecessor when it debuts in the coming weeks.
Image courtesy: Toutiao