LeEco unveiled the Le Max Pro at CES last month, which is the first smartphone in the world to be powered by Qualcomm’s latest Snapdragon 820 chipset. The smartphone has now been spotted by GizmoChina on China’s TENAA hinting at an imminent launch. Also Read - Struggling LeEco plans smartphone with 18:9 aspect ratioAlso Read - LeEco plans smartphone with 18:9 aspect ratio: Report
The Le Max Pro boasts a full metal body and a near-bezeless design. LeEco has also managed to keep the device slim with a thickness of only 8.95mm. Besides the processor, one of the talking points of the smartphone is that it is the first to boast Qualcomm’s ultrasonic fingerprint technology. Also Read - Gionee India operations may be affected amidst financial woes
LeEco Le Max Pro specifications and features: It flaunts a huge 6.3-inch QHD (2560×1440 pixels) display, and is powered by a Snapdragon 820 chipset clocked at 2.2GHz and paired with 4GB of RAM. There is also 64GB internal storage, but no word on if it can be expanded using a microSD card.
On the photography front, the Le Max Pro is equipped with a 21-megapixel camera at the back, and a 4-UltraPixel selfie snapper up front. It also features a 3,400mAh battery with Quick Charge 3.0 support, and connectivity options like dual-SIM card slots, 4G LTE support, Wi-Fi and Bluetooth. It also runs on Android 6.0 Marshmallow out-of-the-box.
While there is no word from LeEco, the fact that the smartphone is listed on TENAA points at an imminent launch. As per earlier reports, the Le Max Pro could be priced around 3,500 Yuan that roughly translates to Rs 36,100.