The technology industry is gearing up for the arrival of 5G, the next generation of communication technology that is expected to bring faster connectivity speeds with greater range and flexibility. 5G is expected to power a major chunk of technology in future including much-anticipated connected smart experiences. As part of the preparation, SoC makers including Qualcomm, Huawei, and MediaTek are currently working on 5G-enabled SoCs along with smartphone designs that will pack the 5G-capable SoCs. In addition to most smartphone makers, companies in the telecommunication sector are also working on 5G-enabled connectivity solutions.
As the Industry gear up for 5G, SoC makers have started testing with prototype devices to ensure that the reference designs are ready for smartphone makers. According to a recent report by IT Home, MediaTek recently showcased its 5G prototype with Helio M70 5G modem. The interesting thing about this prototype is the fact that it is cooled by a fan. However, MediaTek is not the only company to have showcased prototype devices as its competitor Qualcomm also showcased its test device. According to the report, executives for the company stated that “the final 5G commercial device will have MediaTek’s unique low-power design without fans.”
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It is likely that the final design of the 5G device will not come with a fan as the current device design will be counterproductive to the user experience. It is likely that the prototype does not pack the latest 7-nm manufacturing based SoC that the final M70 is expected to pack.
A report by Venture Beat did point out that the 5G devices are expected to be large along with custom cooling solutions. The reason for custom cooling solutions with larger device size is because these devices are likely to consume considerably more power as compared to the first generation of 4G devices because of “simultaneous 4G/5G connection requirements.” The report also pointed out that Qualcomm was focused on ensuring the size of 5G devices small.