It’s already been confirmed that the Meizu 16 and Meizu 16 Plus smartphones are going to launch on August 8. Over the last few months we’ve got a good gist of what the smartphones will have to offer, thanks to the company’s founder Jack Wong. Now however, it’s Meizu’s Senior Vice President Li Nan who has posted render images of the smartphones on Weibo. Besides that, the two smartphones have also appeared on TENAA, further confirming previously suggested specifications.
The renders posted by Nan only confirm what we previously knew. The smartphones are set to to carry a tall screen wrapped around slim bezels with not notch. The back panel of the smartphones feature a metal frame, and a curved glass coating. One of the images also confirms the in-display fingerprint sensor and the dual-rear camera setup touted on the Meizu 16 Plus.
The TENAA listing, on the other hand, reveals the Meizu 16 to feature a 6-inch display and a 2,950mAh battery. It carries a model number of MBB2Q. Previous rumors have suggested the device to sport a Snapdragon 710 SoC, and 6GB of RAM. The Meizu 16 Plus is expected to come with Snapdragon 845 SoC, and 8GB of RAM. The TENNA listing mentions it as the M892Q and confirms it to feature a 6.5-inch screen, and a 3,570mAh battery.
Both smartphones will also be running Android operating system. Whether it will be the Android Nougat or Android Oreo is not specified though. There is a good chance that it will come layered with Flyme OS skin on top.
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While dual-rear cameras and in-display fingerprint sensor are somewhat confirmed, Wong had also mentioned the device to come with other high-end features such as 3D touch support, and copper heat dissipation system. We’ll just have to wait till August 8 to find out if Meizu plans to incorporate these features or decides to drop them.