Earlier this month, Qualcomm unveiled the flagship Snapdragon 845 SoC at an event in Maui, Hawaii. Now, while the chipset will be powering the high-end flagships of 2018, details of Qualcomm s other chipsets for mid-range and affordable have been leaked. These include the Snapdragon 670, 640 and 460. According to the leak on Weibo, all three chipsets will use Qualcomm s own Kryo cores that are based on ARM s Cortex cores. Let s take a look at the specifications of these chipsets. Also Read - MediaTek dominates the sub-Rs 30,000 smartphone space in 2021, where is Qualcomm?
Qualcomm Snapdragon 670 SoCAlso Read - Qualcomm launches a powerful Asus smartphone with price of more than 1 lakh
The successor to Snapdragon 660, which is the chipmaker s most powerful mid-range SoC, the new Snapdragon 670 SoC will be made on 10nm fabrication process. This is a big step up compared to Snapdragon 660 SoC that is made on 14nm process. The CPU will feature an octa-core design comprising of four Kryo 360 cores clocked at 2 GHz and the remaining four Kryo 385 cores clocked at 1.6 GHz. The CPU will be paired with Adreno 620 GPU. Also Read - Top tech news of week: Battlegrounds Mobile India launched, iOS 15 public beta released, more
In the photography department, the Snapdragon 670 SoC will support single camera of up to 26-megapixel resolution, and dual cameras of 13-megapixel + 13-megapixel resolution. In terms of connectivity, it will come with LTE Cat 16 with maximum download speeds of 1Gbps and upload speeds of 150Mbps.
Qualcomm Snapdragon 640 SoC
Similar to Snapdragon 670, the Snapdragon 640 SoC will also be made on 10nm fabrication process. It will also come with an octa-core design, but instead of 4+4, it will come with 6+2 combination. This is possibly due to ARM s DynamIQ that allows to mix and match Cortex-A75 and Cortex A55 CPU cores.
The chipset will feature two Kryo 360 cores clocked at 2.15 GHz and six Kryo 360 cores clocked at 1.55 GHz, paired with Adreno 610 GPU. Now, while the camera specifications remain the same as the Snapdragon 670 SoC, Snapdragon 640 SoC will come with X12 LTE modem with Cat 12 support, which allows for download speeds up to 600Mbps, and upload speeds up to 150Mbps.
Qualcomm Snapdragon 460 Soc
Lastly, the Snapdragon 460 will be built on a 14nm process, which is the same as its predecessor Snapdragon 450. The chipset will feature eight cores – four Kryo 360 cores clocked at 1.8 GHz and four Kryo 360 cores clocked at 1.4 GHz.
Smartphones powered by Snapdragon 460 SoC will can have a single camera of up to 21-megapixel resolution, but there is no word on support for dual camera setup. In terms of connectivity, it will come with X12 LTE modem with Cat 12 support, that offers peak download speeds up to 600Mbps, and upload speeds up to 150Mbps.
More details on the availability and first set of smartphones that will be powered by the new chipsets are expected at CES 2018 in January.