As Qualcomm celebrates the 10-year anniversary of the Snapdragon mobile platform, the company is holding the Snapdragon Summit 2017 in Maui, Hawaii. At the event, Qualcomm announced the next-gen Snapdragon 845 SoC. Samsung’s foundry business has helped Qualcomm to design, fabricate and manufacture the new chipset. Xiaomi’s CEO Lei Jun took the stage to announce that the next Xiaomi smartphone will be powered by the Qualcomm Snapdragon 845 SoC.
Qualcomm did not shed details about the new chipset, but the company will be talking more about it tomorrow. From what we know so far the new chipset will be made on 10nm fabrication process. In terms of improvements, the new chipset is likely to feature third-generation Kryo cores – four based on Cortex-A75 and the remaining four based on Cortex-A55 cores for efficiency. In terms of graphics, Adreno 630 is expected on board with AR and VR-based optimizations.
Rumors also suggests that the new Snapdragon 845 chipset could support dual-camera setups up to 25-megapixel both at the front and back. Also, going by the reports, the Snapdragon 845 SoC is likely to feature the X20 modem, that will be able to push download speeds up to 1.2Gbps.
We will bring more coverage as and when further announcements happen. Till then, stay tuned.
Disclaimer: The correspondent is in Maui, Hawaii on Qualcomm’s invite. Qualcomm paid for his travel and accommodation in Hawaii.