We recently learnt that Qualcomm plans to launch its new Snapdragon 845 chipset this month. And now ahead of the launch, some new but unconfirmed information has been revealed. As per the latest rumor, the new chipset will be built on the old 10nm Low Power Early process, from TSMC, instead of Samsung as it was believed till now. This means, there may not be much improvement in terms of processing.
However, the chipset may come with improvements in terms of third-generation Kryo cores – four of them, based on Cortex-A75. Those will be paired with four A53 cores for efficiency. Reportedly, the graphics will also be upgraded to Adreno 630, though little is known about it beyond further AR and VR optimizations.
Further, the rumor also suggests that the new Snapdragon 845 chipset may also support dual-cameras up to 25-megapixel both on the front and back. Also, going by the report, the chipset will feature the X20 modem, that will be able to push download speeds up to 1.2Gbps.
Additionally, from what we have learnt in earlier rumors, Qualcomm has also been focusing on its Spectra ISP for improved low-light photography, and camera with zero shutter lag. With competitors such as Huawei adding Artificial Intelligence in its Kirin chipsets, it wouldn’t be a surprise if Qualcomm also does the same with the new Snapdragon 845 chipset.
Rest of the details are scarce, but if the launch rumors are to be believed, the new chipset will be announced at the Snapdragon Technology Summit in Maui, Hawaii, which is scheduled to take between December 4-8.