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Qualcomm Snapdragon 855 mobile platform, 3D Sonic Sensor announced at Snapdragon Tech Summit 2018

The new chipset will power many of 2019's flagship Android smartphones.

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At the ongoing Snapdragon Tech Summit 2018 in Maui, Hawaii, Qualcomm announced the next-gen top tier chipset that will be powering the 2019 flagship smartphones. The new chipset will be called Snapdragon 855, and it will bring some key upgrades. Today, Qualcomm only made the announcement, but it will talk about the chipset in detail tomorrow.

The highlight of this year’s event has been 5G, and the Snapdragon 855 SoC will be compatible with the new network band, bringing blazing fast broadband connectivity to smartphones. The new SoC will come with 4th gen AI engine which will bring 3X improvements compared to the Snapdragon 845.

Qualcomm also mentioned that the AI will be 2X faster compared to other 7nm competitor chipsets – Huawei’s Kirin 980 and Apple’s A12 Bionic. This also, sort of, confirms that the chipset will be made on 7nm process.

Qualcomm also announced the 3D Sonic Sensor, an ultrasonic fingerprint scanner that will work even when the screen guard is applied. The sensor will also be able to scan your finger if it is oily, greasy and wet, and unlock the device. The flagship smartphones of 2019 are likely going to come equipped with this under display sensor.

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For more details about the chipset, we will have to wait till tomorrow. However, based on the leaks that have been pouring, the chipset will feature a three-cluster CPU design with a total of eight cores. The configuration will have 4 efficiency cores clocked at 1.8GHz, 3 cores clocked at 2.4GHz for intensive tasks, and the last core hitting a frequency of 2.8GHz to handle even more intensive tasks.

Disclaimer – The writer is in Hawaii, attending the Snapdragon Tech Summit 2018 on Qualcomm’s invite. Qualcomm took care of his travel and stay.

  • Published Date: December 5, 2018 3:16 AM IST