With tech events like Consumer Exhibition Show (CES) and Mobile World Congress (MWC) around the corner, we expect to see most brands unveiling their latest and greatest smartphones. Beyond the marketing gimmicks, however, what makes the most difference is the processor powering these devices. And now we have the leaked benchmark comparisons of all the chipsets that will power the latest crop of flagship smartphones. Also Read - Samsung and LG confirm presence at in-person CES 2022
Chinese publication site MyDrivers has compiled a comparison chart for major flagship chipsets that are due to launch in early 2016. It includes performance graphs of Qualcomm’s Snapdragon 820, Samsung’s Exynos 8890, MediaTek’s Helio X20, Huawei’s Kirin 950 and Apple’s A9 as benchmarked by Geekbench 3 for CPU stress test and GFXBench for GPU performance. Also Read - Galaxy S21 FE to support 25W charging but will Samsung put it in the box?
In terms of CPU performance, Apple’s A9 chip takes the lead in single-core performance, where it logged a score of 2546 points, followed by the Snapdragon 820. Helio X20 and Exynos 8890 seem to closely match. In multi-core test, it’s a completely different picture altogether. Samsung’s Exynos 8890 takes the lead, followed by the Helio X20 and Kirin 950. Also Read - Samsung Galaxy M32 launch in India next week: Top specs, price around Rs 15,000, more
Coming to GPU performance, Snapdragon 820’s Adreno 530 leads the way whereas Exynos 8890’s Mali-T880 GPU takes the second spot. While Apple’s A9 GPU stands third, MediaTek’s Helio X20 and Huawei’s Kirin 950 don’t offer a comparable performance.