Samsung Galaxy S6 tear down points at increased use of in-house chips
Samsung's latest flagship smartphone, the Galaxy S6, claims a number of firsts. It is the first time Samsung is using an all metal and glass casing for its flagship Galaxy smartphone and it is also th
Samsung’s latest flagship smartphone, the Galaxy S6, claims a number of firsts. It is the first time Samsung is using an all metal and glass casing for its flagship Galaxy smartphone and it is also the first to ditch expandable memory. However, a tear down of the Galaxy S6 points out yet another first for Samsung.
While we all know that Samsung has ditched Qualcomm and used its own Exynos processor in the Galaxy S6, the tear down reveals that Samsung has also preferred using its in-house silicon for other components that were earlier sold by Qualcomm, Reuters reports. Citing a Chipworks report, the publication suggests that the Galaxy S6 uses Samsung Semiconductor manufactured power management integrated circuit and modem.
With lesser reliance on Qualcomm for silicon and using components manufactured in-house, Samsung would be able to achieve higher margins, which have plagued the smartphone division in recent quarters.
This does not bode well for Qualcomm, which had hinted at a major hardware partner not using its chips in its upcoming flagship smartphoneAlso Read - Qualcomm launches a powerful Asus smartphone with price of more than 1 lakh Also Read - Top tech news of week: Battlegrounds Mobile India launched, iOS 15 public beta released, more Also Read - Snapdragon 888 Plus is here with upgrades that may puzzle flagship phone buyers