Sony H8266 benchmarks hint at full HD+ 18:9 display and Snapdragon 845 SoC

Sony is gearing up to launch multiple smartphones at MWC 2018 later this month.

  • Published: February 13, 2018 11:14 AM IST

Back in December, we came across a Sony smartphone with the model number H8266. Now the upcoming smartphone has been spotted on AnTuTu, which reveals a few of its important details.

Not surprisingly, the listing confirms yet again that the upcoming Sony smartphone will be powered by Qualcomm’s latest Snapdragon 845 chipset. Accompanying the chipset will be 4GB of RAM, and 64GB internal storage. The smartphone is also expected to run Android Oreo out-of-the-box.

One difference however is the display. While the earlier leak hinted at a 16:9 aspect ratio, the benchmark listing hints at more contemporary features. The upcoming smartphone is expected to come with a full HD+ (2160×1080 pixels) display with an aspect ratio of 18:9.

If recent reports are anything to go by, Sony is gearing up to launch at least two smartphones – Xperia XZ2 and the Xperia XZ2 Pro – at MWC 2018. As the name suggests, the Pro variant is the more expensive of the two.

Based on the leaks, the Xperia XZ2 Pro is likely to come with a bezel-less design. It could also be the world’s first smartphone to boast a 4K OLED display. A recent benchmark list hinted at a display panel manufactured by LG, an 18:9 aspect ratio, and a resolution of 3840×1920 pixels.

The rest of the rumored specifications include Snapdragon 845 chipset, 6GB RAM, 64GB internal storage, dual 12-megapixel camera setup at the back, and a 3.5mm audio jack.

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  • Published Date: February 13, 2018 11:14 AM IST